Sagantec - XTREME


	Reduces coupling capacitance and crosstalk
	Increases manufacturing yield and reliability
	Enhances signal integrity
	Reduces power consumption
	Improves performance


	User defined, net specific or globally spaces and widens interconnect
	Handles any number of interconnect layers
	Supports a variety of routing styles
	Preserves hierarchy and connectivity
	Interfaces with industry standard place and route tools using LEF/DEF
	Accepts shape and symbolic data
	User controlled option for automatically doubling of vias
	Provides full control of spacing and width tradeoff
	Handles large million-gate designs

	XTREME solves difficult physical design issues that are introduced with the advent of deep submicron process technologies. XTREME re-engineers chip interconnect wires to significantly reduce coupling capacitance and crosstalk, reduces critical net loads, and enhances signal integrity, overall reliability and yield. XTREME can operate on all routing levels and maintains the physical design hierarchy and structure.